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ACF

ACF apply to the following products:
TAB Products, COG products, COF products, TOUCH PANEL products, TFT, PDP products, FPC / TCP connection with the PCB, etc. ... as the connection, conductive, insulating function.
COG ACF Parameters.pdf
FOG ACF Parameters.pdf


TUFFY Moisture insulating materials

Uses: moisture-proof, insulation, protection LCD module (TCP, COG and COF)
Features:
Low ion content (Low lonic Contamination)
Low water vapor permeability (Low Moisture Penetration)
High-speed curing at room temperature (6-12 minutes)
Soluble and rework remanufactured (Repairable) 

 

RP-08

Guide features: surface transparent

Density:1.0
Water solubility: Insoluble
Solubility in organic solvents: insoluble.

RP-08 Parameters 


LED packaging materials with EMC

Uses: LED packaging bracket features: high durability and excellent reflective properties of persistent high heat. Anti-UV, high current through highly integrated, can be applied to pressure injection molding packaging, including MAP packages designed with the flexibility to design a smaller size, good easy to cut, good dimensional stability
LED packaging materials with EMC Parameters